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Vivo X200 Series to Feature MediaTek Dimensity 9400 SoC; Color Options Revealed

In Short:Vivo is set to launch its X200 series in China on October 14, featuring the new MediaTek Dimensity 9400 chipset. This advanced processor,...

Vodafone Idea Forms CCaaS Partnership with US-Based Genesys

In Short:Vodafone Idea (Vi) is now entering the contact-center-as-a-service (CCaaS) market by teaming up with US company Genesys. This partnership will help Indian businesses...

Cabinet Approves Extension of Fortified Rice Scheme to Combat Anaemia Until December 2028

In Short:The Union cabinet has extended the free fortified rice scheme under PMGKAY until December 2028, costing ₹17,082 crore. This initiative supports the government's...

Oppo Find X8 Series Set to Launch on October 24 with Dimensity 9400 SoC

In Short:Oppo will launch its Find X8 series on October 24, featuring the new MediaTek Dimensity 9400 processor. This chipset promises 35% faster single-core...

Realme P1 Speed 5G Launching in India on October 15 with Dimensity 7300 SoC

In Short:Realme will launch the P1 Speed 5G smartphone in India on October 15 at 12:00 PM IST. It features a MediaTek Dimensity 7300...

Dozee Aims to Reach Over 2,000 Hospitals Locally by 2028

In Short:Dozee, a health-tech startup, aims to expand to over 2,000 hospitals and 100,000 beds in India and the US by 2028. They currently...

Honor X60 Series Design Teased Before October 16 Launch Event

In Short:Honor recently teased its new X60 series smartphones, revealing designs with circular camera modules and a potential dual front camera on the Pro...

Tariff Hikes: Impact on Reliance Jio, Bharti Airtel, and Vodafone Idea

In Short:Bharti Airtel is expected to show stronger revenue growth in the September quarter, outperforming rivals Reliance Jio and Vodafone Idea due to recent...

Probe Links Tata Electronics Blaze to Anodising Plant Fire Source

In Short:The Tamil Nadu government identified that a fire at the Tata Electronics unit in Hosur was likely caused by a thermostat failure in...

DARPA Teams Up on AI-Enhanced “Blisk” Technology Collaboration

In Short:DARPA has awarded a project to researchers from MIT, CMU, and Lehigh University focused on optimizing multi-material structures for aerospace technologies. The team...

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